#  OptoTEC™ MSX 系列

MSX系列采用先进的陶瓷材料、专有的自动化工艺以及下一代热电材料，可将制冷能力提高10%，并确保更高的工艺可重复性。

多级热电制冷器（TEC）在冷端最小可以做到2.0 x 4.0 mm，而高度（厚度）可低至：

- 2级热电制冷器3.3 mm
- 3级热电制冷器3.8 mm
- 4级热电制冷器3.9 mm

![](/thermal-wizard/images/MSX-Family.png)

## Features

- 微小的占位面积
- 精确的温度控制
- 可靠的固态运行
- 能够在高温应用中运行
- 没有声音和振动
- 符合RoHS要求

## Applications

- [红外传感器​](/cn/applications/infrared-range-sensors)
- [用于小型光学图像感测应用的多级微型热电制冷器​](/cn/thermal-technical-library/application-notes/multistage-micro-thermoelectric-coolers-optical-image-sensing-applications)
- [CMOS 传感器的冷却](/cn/applications/cooling-cmos-sensors)

## Products in this series

- [MSX2-041-F1N-0707-06-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014127) — MFG Part Number: 387014127; Maximum Cooling Power (Qc): 1.3 W
- [MSX2-041-F1N-0707-08-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014128) — MFG Part Number: 387014128; Maximum Cooling Power (Qc): 13.5 W
- [MSX2-041-F1N-0707-10-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014129) — MFG Part Number: 387014129; Maximum Cooling Power (Qc): 13.5 W
- [MSX2-041-F1N-0707-15-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014131) — MFG Part Number: 387014131; Maximum Cooling Power (Qc): 13.5 W
- [MSX2-041-F1N-0707-13-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014130) — MFG Part Number: 387014130; Maximum Cooling Power (Qc): 13.5 W
- [MSX2-041-F1N-0707-12-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014132) — MFG Part Number: 387014132; Maximum Cooling Power (Qc): 13.5 W
- [MSX2-041-F1N-0707-09-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014438) — MFG Part Number: 387014438; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-09-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387009176) — MFG Part Number: 387009176; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-06-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014545) — MFG Part Number: 387014545; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-082-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014546) — MFG Part Number: 387014546; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-085-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014547) — MFG Part Number: 387014547; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-10-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014548) — MFG Part Number: 387014548; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-12-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014549) — MFG Part Number: 387014549; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-13-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014550) — MFG Part Number: 387014550; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-15-11-W2](/cn/products/thermoelectric-cooler-modules/micro-MSX-series/387014551) — MFG Part Number: 387014551; Maximum Cooling Power (Qc): 13.5 W

## ![](/thermal-wizard/images/2stagemsx.png)2-Stage Thermoelectric Coolers

## ![](/thermal-wizard/images/3stagemsx.png)3-Stage Thermoelectric Coolers

## General Specifications

 **Series (Solder Construction)**

| Model | Solder Type | Melt Temp |
|---|---|---|
| MSX | (SnSb) Tin Antimony | 232°C |
| HSX | (AuSn) Gold Tin | 280°C |

 **Ceramic Materials**

| Ceramic Materials | Thermal Conductivity | Option |
|---|---|---|
| (ALO) Alum Oxide | 24 W/mK | F1 |
| (ALN) Alum Nitride | 170 W/mK | F1N |

 **Surface Finish Options**

| Solder Type | Melt Temp | Option |
|---|---|---|
| Au plating (Hot/Cold Surface) |  | GG |
| Non-Metallized Hot and/or Cold face |  | 11 |
| Pre-tinning Hot and/or Cold face with 118˚C InSn Solder | 118˚C | 22 |
| Pre-tinning Hot and/or Cold face with 138˚C BiSn Solder | 138˚C | 33 |

 **Lead Attachment**

| Solder Type | Option |
|---|---|
| Uninsulated leads (2 inches) | W2 |
| Au plated Posts | WO |

##  Optical TEAs

 MSX multistage micro thermoelectric coolers are available as a standalone or integrated into an optical package called **Optical TEAs**. **Tark Thermal Solutions** has a proprietary bonding technique to adhere TECs to optical packages with minimal solder voiding. Solder types used are below melt temperatures of TEC solder construction and optical packaging is specified by the customer.

![Minimal to no solder voiding](/sites/default/files/inline-images/Optical_TEAs_minimal_solder_voiding.png) **Minimal to no solder voiding**

##  Optical TEA Capabilities

 **Surface Finish Options**

| Solder Type | Melt Type |
|---|---|
| SnInAg | 206°C |
| BiSn | 138°C |
| InSn | 117°C |

 \* 塔克热系统及其代理商提供的任何信息均被认为准确和可靠。所有规格和参数如有更改，恕不另行通知。

**Original URL:** https://tark-solutions.com/cn/products/thermoelectric-cooler-modules/micro-MSX-series