#  OptoTEC™ MSXシリーズ

MSXシリーズは、先進のセラミック材料、独自の自動化技術、次世代サーモエレクトリック材料を採用し、冷却能力を最大10%向上させ、高いプロセス再現性を保証します。

この多段TECは、コールド側のフットプリントが2.0 x 4.0 mmと非常に小さく、高さの厚さは3.3 mmです：

- 2段で3.3mm
- 3段で3.8mm
- 4ステージ用4.9mm

![](/thermal-wizard/images/MSX-Family.png)

## Features

- 小型形状サイズ
- 正確な温度制御
- 信頼性の高い固体動作
- 騒音も振動もなし
- 直流動作
- RoHS準拠

## Applications

- [IR測距センサ​](/ja/applications/infrared-range-sensors)
- [光イメージセンサ向け多段のマイクロ熱電冷却器​](/ja/thermal-technical-library/application-notes/multistage-micro-thermoelectric-coolers-optical-image-sensing-applications)
- [CMOSセンサーの冷却](/ja/applications/cooling-cmos-sensors)

## Products in this series

- [MSX2-041-F1N-0707-06-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014127) — MFG Part Number: 387014127; Maximum Cooling Power (Qc): 1.3 W
- [MSX2-041-F1N-0707-08-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014128) — MFG Part Number: 387014128; Maximum Cooling Power (Qc): 13.5 W
- [MSX2-041-F1N-0707-10-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014129) — MFG Part Number: 387014129; Maximum Cooling Power (Qc): 13.5 W
- [MSX2-041-F1N-0707-15-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014131) — MFG Part Number: 387014131; Maximum Cooling Power (Qc): 13.5 W
- [MSX2-041-F1N-0707-13-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014130) — MFG Part Number: 387014130; Maximum Cooling Power (Qc): 13.5 W
- [MSX2-041-F1N-0707-12-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014132) — MFG Part Number: 387014132; Maximum Cooling Power (Qc): 13.5 W
- [MSX2-041-F1N-0707-09-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014438) — MFG Part Number: 387014438; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-09-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387009176) — MFG Part Number: 387009176; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-06-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014545) — MFG Part Number: 387014545; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-082-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014546) — MFG Part Number: 387014546; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-085-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014547) — MFG Part Number: 387014547; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-10-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014548) — MFG Part Number: 387014548; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-12-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014549) — MFG Part Number: 387014549; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-13-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014550) — MFG Part Number: 387014550; Maximum Cooling Power (Qc): 13.5 W
- [MSX3-070-F1N-0808-15-11-W2](/ja/products/thermoelectric-cooler-modules/micro-MSX-series/387014551) — MFG Part Number: 387014551; Maximum Cooling Power (Qc): 13.5 W

## ![](/thermal-wizard/images/2stagemsx.png)2-Stage Thermoelectric Coolers

## ![](/thermal-wizard/images/3stagemsx.png)3-Stage Thermoelectric Coolers

## General Specifications

 **Series (Solder Construction)**

| Model | Solder Type | Melt Temp |
|---|---|---|
| MSX | (SnSb) Tin Antimony | 232°C |
| HSX | (AuSn) Gold Tin | 280°C |

 **Ceramic Materials**

| Ceramic Materials | Thermal Conductivity | Option |
|---|---|---|
| (ALO) Alum Oxide | 24 W/mK | F1 |
| (ALN) Alum Nitride | 170 W/mK | F1N |

 **Surface Finish Options**

| Solder Type | Melt Temp | Option |
|---|---|---|
| Au plating (Hot/Cold Surface) |  | GG |
| Non-Metallized Hot and/or Cold face |  | 11 |
| Pre-tinning Hot and/or Cold face with 118˚C InSn Solder | 118˚C | 22 |
| Pre-tinning Hot and/or Cold face with 138˚C BiSn Solder | 138˚C | 33 |

 **Lead Attachment**

| Solder Type | Option |
|---|---|
| Uninsulated leads (2 inches) | W2 |
| Au plated Posts | WO |

##  Optical TEAs

 MSX multistage micro thermoelectric coolers are available as a standalone or integrated into an optical package called **Optical TEAs**. **Tark Thermal Solutions** has a proprietary bonding technique to adhere TECs to optical packages with minimal solder voiding. Solder types used are below melt temperatures of TEC solder construction and optical packaging is specified by the customer.

![Minimal to no solder voiding](/sites/default/files/inline-images/Optical_TEAs_minimal_solder_voiding.png) **Minimal to no solder voiding**

##  Optical TEA Capabilities

 **Surface Finish Options**

| Solder Type | Melt Type |
|---|---|
| SnInAg | 206°C |
| BiSn | 138°C |
| InSn | 117°C |

 \* タークサーマルソリューションズ社およびそのエージェントが提供する情報はどれも正確で信頼できるものです。全ての仕様は予告なしで変更することがあります。

**Original URL:** https://tark-solutions.com/ja/products/thermoelectric-cooler-modules/micro-MSX-series