OptoTEC™ MSX 系列

MSX系列采用先进的陶瓷材料、专有的自动化工艺以及下一代热电材料，可将制冷能力提高10%，并确保更高的工艺可重复性。

多级热电制冷器（TEC）在冷端最小可以做到2.0 x 4.0 mm，而高度（厚度）可低至：

2级热电制冷器3.3 mm
3级热电制冷器3.8 mm
4级热电制冷器3.9 mm

Features

微小的占位面积
精确的温度控制
可靠的固态运行
能够在高温应用中运行
没有声音和振动
符合RoHS要求

Applications

2-Stage Thermoelectric Coolers

Check up to 3 TECs then click COMPARE to view a comparison datasheet

3-Stage Thermoelectric Coolers

Check up to 3 TECs then click COMPARE to view a comparison datasheet

General Specifications

Series (Solder Construction)

Model	Solder Type	Melt Temp
MSX	(SnSb) Tin Antimony	232°C
HSX	(AuSn) Gold Tin	280°C

Ceramic Materials

Ceramic Materials	Thermal Conductivity	Option
(ALO) Alum Oxide	24 W/mK	F1
(ALN) Alum Nitride	170 W/mK	F1N

Surface Finish Options

Solder Type	Melt Temp	Option
Au plating (Hot/Cold Surface)		GG
Non-Metallized Hot and/or Cold face		11
Pre-tinning Hot and/or Cold face with 118˚C InSn Solder	118˚C	22
Pre-tinning Hot and/or Cold face with 138˚C BiSn Solder	138˚C	33

Lead Attachment

Solder Type	Option
Uninsulated leads (2 inches)	W2
Au plated Posts	WO

Optical TEAs

MSX multistage micro thermoelectric coolers are available as a standalone or integrated into an optical package called Optical TEAs. Tark Thermal Solutions has a proprietary bonding technique to adhere TECs to optical packages with minimal solder voiding. Solder types used are below melt temperatures of TEC solder construction and optical packaging is specified by the customer.

Minimal to no solder voiding

Optical TEA Capabilities

Surface Finish Options

Solder Type	Melt Type
SnInAg	206°C
BiSn	138°C
InSn	117°C

* 莱尔德热系统及其代理商提供的任何信息均被认为准确和可靠。所有规格和参数如有更改，恕不另行通知。