Thermoelectric Chillers for Semiconductor Metrology & Inspection Systems

Introduction

The implementation of automated metrology systems has been a key to achieving cost effective semiconductor fabrication. The complex nature of semiconductor fabrication requires multiple tests between processing steps to inspect defects as well as measure dimensional properties including thickness, refractive index, resistivity and stress of the thin films. Because thermal noise can impact the image resolution of sensitive optical components in automated metrology systems, a thermal management system is required.




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OEM Perspectives: Recirculating Chillers for Low-Power Lasers

Introduction

Lasers come in many different sizes and power levels. High power lasers are commonly used for brazing, metal cutting, deep metal welds and metal cleaning, while low power lasers can be used for printing & marking, soldering, plastic welding and laser powder remelting. For all laser technologies, OEMs seek advanced cooling of the power source and the laser optics to maintain peak performance and long life operation.




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Thermoelectric Chillers for Low-Power Lasers

Introduction

Industrial lasers come in various sizes and power levels. Brazing, metal cutting, deep metal welds and metal cleaning require high-power lasers while printing & marking, soldering, plastic welding and laser powder remelting use low power lasers. Temperature stabilization is key to maintaining peak performance for any industrial laser system.




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Nextreme™ NRC400 Performance Chiller (Japanese - 日本人)

The Nextreme NRC400 is a recirculating chiller designed for precise temperature control of analytical instrumentation, industrial lasers and imaging. The NRC400 is a thermoelectric-based recirculating chiller with few moving parts offering solid-state construction and high reliability. It is also environmentally friendly as no hazardous refrigerants are used. Users can easily control temperature setpoints and alarms via the LCD touchscreen display.  

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Nextreme™ NRC400 Performance Chiller Quick Start Guide (Japanese - 日本人)

This is a quick start guide to get your Nextreme™ NRC400 Chiller product running. For detailed information and specific instructions, refer to the user manual. 

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Miniature Thermoelectric Coolers

The OptoTEC™ OTX/HTX series of miniature thermoelectric coolers from Laird Thermal Systems Inc. is designed for high-temperature environments found in telecommunications, industrial, autonomous, and photonics applications.

Read more here: https://www.photonics.com/Content.aspx?CID=OptoTEC_OTXHTX_Series

OEM Perspectives: Recirculating Chillers for Biotech Research

Introduction

Supporting the imaging needs of the multifaceted life science and biotechnology research industries, modern microscopy equipment offers magnification, resolution, and contrast for visualization, measurement and analysis of microstructures. Advancements in microscopes leverage visible and nonvisible light to provide high-quality images of cells. There are four types of microscopy: optical, electron, scanning probe microscopy, and the developing field of X-ray microscopy.




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Thermoelectric Chillers for Precise Cooling of Digital Microscopes

Introduction

Modern microscopy equipment offers magnification, resolution, and contrast for visualization, measurement and analysis of microstructures to support imaging needs in life science and biotechnology research. Laboratory technicians have access to more sophisticated microscopy equipment than ever before providing high-quality images of cell structures. There are four types of microscopes; optical, electron, scanning probe microscopy, and the developing field of X-ray microscopy.




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Cooling Solutions for Autonomous Systems

Advances in autonomous technologies, such as smart headlights, autonomous systems for collision avoidance, and infotainment systems, require enhanced thermal protection of critical electronics to ensure optimized performance. These emerging intelligent autonomous systems are increasingly complex while decreasing in size and weight. Packing more functionality into smaller footprints has increased the heat flux density and thermal challenges in autonomous systems.

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