OptoTEC™ MSX Series

Tark Thermal Solutions OptoTEC™ MSX Series delivers industry-leading micro multistage thermoelectric cooling performance in a compact footprint—engineered for seamless integration into a wide range of optical packages. Built with advanced ceramics, proprietary solder bonding, and next-generation thermoelectric materials, the MSX Series boosts cooling capacity by up to 10% while maintaining micro-scale dimensions.

The multistage MSX Series TECs offer micro footprints on the cold side down to 2.0 x 4.0 mm with thicknesses down to 3.3 mm for 2-stage, 3.8 mm for 3-stage. Heat-pumping capability up to 5 W, these solid-state, low-current coolers provide reliable, maintenance-free temperature stabilization from room temperature down to 180 K with zero outgassing.

Features

  • Miniature footprints
  • Precise temperature control
  • Reliable solid-state operation
  • Operates in high-temperature applications
  • No sound or vibration
  • RoHS-compliant

 

2-Stage Thermoelectric Coolers

Check up to 3 TECs then click COMPARE to view a comparison datasheet

3-Stage Thermoelectric Coolers

Check up to 3 TECs then click COMPARE to view a comparison datasheet

General Specifications

Series (Solder Construction)

Model Solder Type Melt Temp
MSX (SnSb) Tin Antimony 232°C
HSX (AuSn) Gold Tin 280°C

 

Ceramic Materials

Ceramic Materials Thermal Conductivity Option
(ALO) Alum Oxide 24 W/mK F1
(ALN) Alum Nitride 170 W/mK F1N

 

Surface Finish Options

Solder Type Melt Temp Option
Au plating (Hot/Cold Surface)   GG
Non-Metallized Hot and/or Cold face   11
Pre-tinning Hot and/or Cold face with 118˚C InSn Solder 118˚C 22
Pre-tinning Hot and/or Cold face with 138˚C BiSn Solder 138˚C 33

 

Lead Attachment

Solder Type Option
Uninsulated leads (2 inches) W2
Au plated Posts WO

 

Optical TEAs

MSX multistage micro thermoelectric coolers are available as a standalone or integrated into an optical package called Optical TEAs. Tark Thermal Solutions has a proprietary bonding technique to adhere TECs to optical packages with minimal solder voiding. Solder types used are below melt temperatures of TEC solder construction and optical packaging is specified by the customer.

Minimal to no solder voiding

Minimal to no solder voiding

Optical TEA Capabilities

 

Surface Finish Options

Solder Type Melt Type
SnInAg 206°C
BiSn 138°C
InSn 117°C

 

* Any information furnished by Tark Thermal Solutions and its agents is believed to be accurate and reliable. All specifications are subject to change without notice.